Samtec Launches Highperformance Connectors for Nextgen Power Needs

In today's rapidly evolving electronics landscape, the demand for higher power density and more compact designs has never been greater. As devices shrink in size while requiring increased power and data capacity, connector technology faces unprecedented challenges and opportunities.

Pioneering High-Density Power Solutions

Samtec, a global leader in interconnect solutions, has introduced groundbreaking high-power connector systems that redefine performance standards. The company's innovative approach combines power and signal transmission in remarkably compact form factors, delivering up to 60 amps of power alongside high-speed data transfer.

The secret to Samtec's success lies in its proprietary high-density power blade design. This technology achieves exceptional conductivity within minimal space, offering unparalleled efficiency for both board-to-board and discrete cable applications.

mPOWER® Series: A Game-Changer for Compact Design

Samtec's flagship mPOWER® series stands out with its industry-leading 18 amps-per-blade power density in ultra-miniature packages. The series offers:

• Vertical or right-angle mounting options
• Stacking heights from 5mm to 20mm
• Configuration flexibility for board-to-board, wire-to-board, and wire-to-wire applications
• Space savings up to 40% compared to conventional power systems

Advanced Protection and Reliability

Samtec's Micro Mate® and Power Mate® systems incorporate independent shielded contacts, providing robust protection against electrical and mechanical damage. These solutions ensure stable operation across diverse environments while maintaining compact footprints.

Key Product Highlights

The company's product portfolio includes several standout solutions:

• UMPT Series: 2mm pitch connectors handling 18 amps with SMT or through-hole mounting options
• UMPS Series: Vertical-mount 2mm pitch high-power blade connector sockets
• GPSO Series: PCB stacking alignment hardware with 4-30mm stack heights

Pushing Speed and Density Boundaries

Samtec's AcceleRate® mP 0.635mm signal/power array supports staggering 64 Gbps PAM4 rates, making it ideal for AI, 5G, and high-performance computing applications. This innovative series features:

• Rotating power blade design for enhanced thermal performance
• PCIe® 6.0/CXL® 3.2 compatibility
• Open pin field design with 5mm and 10mm low-profile stacking options

High-Power Reliability Solutions

For mission-critical applications, Samtec offers:

• EXTreme Ten60Power™: 60-amp modular high-power/signal hybrid connectors for midplane/backplane use
• EXTreme LPHPower™: Ultra-low 7.5mm profile with 30-amp capacity
• PowerStrip™ Series: High-power blind-mate solutions with current handling up to 58.7 amps per blade

High-Speed Signal Transmission

Complementing its power solutions, Samtec delivers advanced high-speed connectors:

• Q2™ Series: Shielded 25 Gbps NRZ performance with power combination options
• Q Rate® Slim: 28 Gbps performance in narrow-width packages
• Q Strip®: 14.0 GHz/28 Gbps performance with integrated ground/power planes

These innovations demonstrate Samtec's commitment to enabling smaller, faster, and more powerful electronic devices across industries from data centers to aerospace.